The Xbox 360 embeds the Microsoft XCPU chipset, a product of collaboration between Microsoft and IBM codenamed “Xenon”, which gives impressive processing power, able to handle even the most modern games, in a familiar architecture.
What is the processor repair with Reflow method?
The processor is joint with the motherboard on a BGA (Ball Grid Array), thanks to which a permanent connection between the two is achieved. The BGA consists of many small conductive balls arranged in a grid, so as to complete a circuit with your motherboard and allow the communication with the rest of the system.
For various reasons, such as
For various reasons, such as a manufacturing defect, or extreme temperatures encountered during the operation of the chipset, may cause damage such as cracks in the BGA, and the circuit will malfunction. Then, the Xbox 360 will often fail, and can not be repaired by conventional methods, but only with specialized techniques like Reballing.
The reballing method aims at reconstructing the circuit from scratch by utilizing advanced BGA/SMD rework equipment.
If you observe one or more of the following
- Your system stops responding regularly, issue that’s only solved by resetting your console.
- Cricital errors lead to abrupt shutdown or reboot.
- The Xbox 360 is not working at all.
Then it is very likely we can repair the part that causes the malfunction by using the reballing method.
The repair is extremely advantageous in most cases, as the CPU is the heart of your console, and the most expensive piece on it. Without specialized repair, you will be forced to replace the entire console!
In order to proceed with reballing repair, the exact source of the damage must be diagnosed, and its repairing process must be evaluated and deemed suitable as well as feasible. The viability and success rates of the reflow repair can be as high as 90% of the cases!
Our expert engineers and technicians, using advanced BGA/SMD rework stations, take up to the task of reconstructing the processor’s damaged circuit. This is achieved by applying high intensity infrared radiation and localized heat sources, so as to liquify the faulty BGA, and then completely remove all its connectors. Then, a new ball grid is synthesized and applied on top of the PCB with surgical precision, and the chipset is reattached.
Don’t think about it…
Bring your Xbox 360 at EasyService, and we will make a complicated, difficult process easy!